Wire Shorting Defect Mitigation on Substrate LGA Device Through Wirebond Capillary Adjustment

Semiconductor packaging technologies are getting more challenging with regards to assembly manufacturing due to several factors such as complex package layout, process and machine capability, and materials compatibility. This paper discusses the wirebonding process difficulty and the solution to mitigate the wire-to-wire shorting defect on a substrate land grid array (LGA) device that causes low yield on engineering trials. Using a high-speed camera equipment, the actual process was monitored. It was then noticed that the cause of wire-to-wire shorting issue was a capillary hitting on previous wire. Ultimately, with the new capillary design and process optimization, wire-to-wire shorting defect was successfully mitigated.